???? L lead-free, reflow-soldering is available small and surface mount package ? ??C?^ optical switches, transmission sensor item symbol conditions min. typ. max. unit. ta25 ?? maximum ratings item symbol rating unit ? ? ? topr. tstg. tsol. 2580 30100 260 ta25 ?R v r 30 v reverse voltage operating temp. storage temp. soldering temp. photodiodes U?`?`g? ?g???` -2.8(l)1.4(w)0.9(h)mm sep.2012 HP601??g????`?????`?g?m?? the h601 is a p hoto diode wit h a small and surface mount package. HP601 i s a compact size and easy to mount on small space. ??` features applications electro-opticalcharacteristics Y??d????gMi?????????H??? ?_J? t he contents of this data sheet are subject to change without ad vance notice for the purpose of improvement. when using this p roduct, would you please refer to the latest specifications. ?j g ???? ? ?`?L ? short circuit current dark current capacitance response speed spectral sensitivity peak wavelength half angle i sc id ct tr, ts p ? e v 1,000lx *1 v r 10v v r 0v, f1mhz 3.2 5.8 0.2 4001100 900 65 50 a na pf sec nm nm deg 1. ???2856k????? color temp. = 2856k standard tungsten lamp v r 10v, r l 1k HP601
sep.2012 Y??d????gMi?????????H??? ?_J? t he contents of this data sheet are subject to change without ad vance notice for the purpose of improvement. when using this p roduct, would you please refer to the latest specifications. HP601 photodiodes ??` g/?R? ct/v r ?j/?? i sc /e v ? /??? id/ta /?R? id/v r ? ?j/?R? i sc /v f 0.0 1.0 2.0 3.0 4.0 00.10.20.30.40.5 gct capacitance between terminals ?Rv r reverse voltage ?s relative sensitivity L wavelength ?ji sc short circuit current ??ev illuminance ?% relative sensitivity ??deg. angle i d dark current ?Rv r reverse voltage ?ji sc short circuit current ?Rv f forward voltage id dark current ???ta ambient temperature v 10 4 10 3 10 1 10 0 10 2 10 3 a 10 5 lx a 10 -1 10 2 10 0 10 -1 10 1 10 -2 -20 0 20 40 60 80 ta = 25 ta = 25 v r = 10v 500 400 600 0 20 40 60 80 100 % 700 800 900 1000 1100 nm ta = 25 120 10 0 10 -1 10 -2 10 -3 51015202530 0 v a ta = 25 a 50 0 0 20 40 60 80 90 20 40 60 80 90 50 100 50 100 100 ta = 25 0 5 10 pf 10 15 20 25 30 v 0 5 ta = 25, =1mhz ?` reflow soldering ?? manual soldering 1. ???????????????`???? ???`?????Tk?????????`???? u_J?? 2. ?`ru?????????`??Tk????? ? 3. ?`2?1?K?8rg?2??I??` 2????? 300 200 100 150180 max40sec 60120sec max250 230 14/sec max 10sec 14/sec temperature time 2603?? u?????r ??u??? ?? manual soldering please solder by the limit once within 260 3 second. to avoid the product is transformed and breakdown, it needs to take care that the power should not join to the product at soldering or immediately after soldering. 1. even it is within the temperature profile condition as below , the disconnection of ag wire in the package might be caused by the stress join the package due to t he pcb's curving and bending. please take care about the condition of reflow machine when use . 2. please do not pile something on the product at reflow solder ing because the transformation of the package resin may caused. 3. when you do the reflow soldering twice, please process secon d reflow soldering within 8 hours after finish the first soldering. the reflow soldering is possi ble twice. 100lx 200lx 300lx 400lx 1000lx 500lx
HP601 sep.2012 ? dimensionsunit : mm Y??d????gMi?????????H??? ?_J? t he contents of this data sheet are subject to change without ad vance notice for the purpose of improvement. when using this p roduct, would you please refer to the latest specifications. ?/a reference |?I/tokyo sales ?I/kyoto sales /overseas tel 03-6455-0280 fax 03-3461-1566 tel 0774-20-3559 fax 0774-24-1031 tel +81-(0)774-24-1138 fax +81-(0)774-24-1031 url http://www.kodenshi.co.jp photodiodes ??` anode cathode 2.0 1.40.15 2.8 0.15 1.20.1 0.90.15 0.30.1 0.5 0.15 0.4(0.15) chip center ?X??` `???????0.2mm0.3mm?X ? ?`??`???? ???g???_J? as the metal mask of the screen process printing, 0.2mm~ 0.3mm thickness is recommended. however, there i s a thing that soldering ch anges with the reflow condition solder paste substrate material etc.please use it after it confirms it by real use conditions. y? packing specification ?? cautions on storage u?????????????``?]?? ??`?????`N?? yg 1500/1` in order to avoid the moisture a bsorption under transportation of this product and storage, it sealed up in the dampproof bag with dry medicine. a display seal is stuck on a plastic reel and a dampproof bag. the minimum packing quantity 1,500pcs/reel 1. to avoid getting damp of thi s product, the dry box preservat ion is preferable before it opened. however, if it is impossibl e, the conditions stated below is recommended. temperature 1030humidity 60rh or less 2. because this product packs the dampproof, it is recommended that used within 48 hours after opening. and when preserve again after opened, dry box preservation or using dampproof bag with dry medicine and seal up again with s eal machine are recommended. 3. three months passed with the dampproof packed or 48 hours or more passed after the dampproof packing is opened, please do t he baking prosessing in the below condition before use. 6072100hrs (reels) 802448hrs (balk) 1. u??????_??h??????????????? ??X ? 10 30? 60%rh 2. u???y?????_48rg??????X? _??????????{r?????``?]? 3. ?y?B3????y_?24rg?U^u????????`??I? 60 72rg100rg(?`??B??X) 80 24rg48rg(??B??X)
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